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| Datum des Inkrafttretens | Beschreibung der Änderung | Datei download |
|---|---|---|
| Oct 1, 2023 | 513556 - Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about 52559 series production order from Molex Kagoshima & Molex Malaysia will be consolidated to Molex Malaysia. No changes will be made to product as part of this change. |
Herunterladen |
| Oct 10, 2022 | 512691 - Retraction of obsolete. this PCN is a partial retraction/recall for previously issued pcn for obsolete on attached PNs. | Herunterladen |
| Sep 30, 2015 | GCM 10600080 - Product Obsolescence Notification Last Order Entry Date: 7/31/2015 Obsolescence Effective Date: 9/30/2015 |
Herunterladen |
| Mar 28, 2014 | GCM 10625845 - Upgrade / Rearrangement Of Tooling / Equipment. | Herunterladen |
| Teil # | Beschreibung |
|---|---|
| 52559-0652 | FFC/FPC Connector, Vertical, SMT, ZIF, 6 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-0672 | FFC/FPC Connector, Vertical, SMT, ZIF, 6 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-0853 | FFC/FPC Connector, Vertical, SMT, ZIF, 8 Circuits, Lead-Free, Gold (Au) Contact Plating |
| 52559-0870 | FFC/FPC Connector, Vertical, SMT, ZIF, 8 Circuits, Lead-Free |
| 52559-0952 | FFC/FPC Connector, Vertical, SMT, ZIF, 9 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-0972 | FFC/FPC Connector, Vertical, SMT, ZIF, 9 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-1052 | FFC/FPC Connector, Vertical, SMT, ZIF, 10 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-1072 | FFC/FPC Connector, Vertical, SMT, ZIF, 10 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-1252 | FFC/FPC Connector, Vertical, SMT, ZIF, 12 Circuits, Lead-Free, Gold (Au) Plating, High Barrier Packaging |
| 52559-1272 | FFC/FPC Connector, Vertical, SMT, ZIF, 12 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |