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| Datum des Inkrafttretens | Beschreibung der Änderung | Datei download |
|---|---|---|
| Oct 1, 2023 | 513556 - Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about 52559 series production order from Molex Kagoshima & Molex Malaysia will be consolidated to Molex Malaysia. No changes will be made to product as part of this change. |
Herunterladen |
| Nov 19, 2021 | 510454 - Equipment Transfer, Production Transfer or Rearrangement. Adding additional Manufacturing location for terminals attached to secure supply due to capacity constraint at molex malaysia | Herunterladen |
| Mar 18, 2015 | GCM 10671544 - Tooling / Equipment Transfer. The purpose of this letter is to notify you that 1 assembly machine would be transferred from Kagoshima East plant to Malaysia plant. The manufacture location for the product would be changed accordingly. Kagoshima East plant also continue to mass produce 52559 series products with 2 other assembly machines. Since Malaysia will mass produce 52559 series products by the transferred machine, the label would be different with lot "ML" for Malaysia products ("Q" lot for Kagoshima East products). | Herunterladen |
| Mar 28, 2014 | GCM 10625845 - Upgrade / Rearrangement Of Tooling / Equipment. | Herunterladen |
| Jan 31, 2013 | Changing Trade Name from FORTRON to DURAFIDE |
Herunterladen |
| Teil # | Beschreibung |
|---|---|
| 52559-0652 | FFC/FPC Connector, Vertical, SMT, ZIF, 6 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-0672 | FFC/FPC Connector, Vertical, SMT, ZIF, 6 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-0853 | FFC/FPC Connector, Vertical, SMT, ZIF, 8 Circuits, Lead-Free, Gold (Au) Contact Plating |
| 52559-0870 | FFC/FPC Connector, Vertical, SMT, ZIF, 8 Circuits, Lead-Free |
| 52559-0952 | FFC/FPC Connector, Vertical, SMT, ZIF, 9 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-0972 | FFC/FPC Connector, Vertical, SMT, ZIF, 9 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-1052 | FFC/FPC Connector, Vertical, SMT, ZIF, 10 Circuits, Lead-Free, Gold (Au) Contact Plating, High Barrier Packaging |
| 52559-1072 | FFC/FPC Connector, Vertical, SMT, ZIF, 10 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |
| 52559-1252 | FFC/FPC Connector, Vertical, SMT, ZIF, 12 Circuits, Lead-Free, Gold (Au) Plating, High Barrier Packaging |
| 52559-1272 | FFC/FPC Connector, Vertical, SMT, ZIF, 12 Circuits, Lead-Free, with Tape Packaging Center Placement Holes |